Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC Dublin Core Títol Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC Autor Er-Ping Li Matèria Physical Sciences and Engineering Electrical & Electronics Engineering Editor Wiley Data de publicació 2012 Identificador 9781118166727 Font https://onlinelibrary.wiley.com/doi/book/10.1002/9781118166727 Etiquetes Electrical & Electronics Engineering, Physical Sciences and Engineering Col·lecció Physical Sciences and Engineering ← ítem anterior Ítem següent →
